Conductive trace interconnection tape

A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate, the conductive trace interconnect tape comprising:

• a top insulating layer formed from electrically insulating material and configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape, the top insulating layer having a length greater than a width, the top insulating layer including a plurality of first perforations spaced apart from one another and oriented along the width and transverse to the length, each of the first perforations including a series of linearly-aligned through holes in the top insulating layer;
• an electrically conductive layer positioned underneath the top insulating layer, the electrically conductive layer formed from electrically conductive material and including a plurality of electrical interconnect traces spaced apart from one another and oriented along the width of the top insulating layer and transverse to the length of the top insulating layer;
• a bottom insulating layer positioned underneath the electrically conductive layer, the bottom insulating layer formed from electrically insulating material and configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate, the bottom insulating layer having a length greater than a width, the bottom insulating layer including a plurality of second perforations spaced apart from one another and oriented along the width and transverse to the length, each of the second perforations including a series of linearly-aligned through holes in the bottom insulating layer;
• a top adhesive layer that bonds a lower surface of the top insulating layer to an upper surface of the electrically conductive layer and an upper surface of the bottom insulating layer;
• a middle adhesive layer that bonds a lower surface of the electrically conductive layer to an upper surface of the bottom insulating layer;
• and
• a bottom adhesive layer that bonds a lower surface of the bottom insulating layer to a surface of the printed circuit board or flexible circuit substrate.

A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate, the conductive trace interconnect tape comprising:

• a top insulating layer formed from electrically insulating material and configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape, the top insulating layer having a length greater than a width;
• a bottom insulating layer positioned underneath the top insulating layer, the bottom insulating layer formed from electrically insulating material and configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate, the bottom insulating layer having a length greater than a width;
• and
• an electrically conductive layer positioned between the top insulating layer and the bottom insulating layer, the electrically conductive layer formed from electrically conductive material and including a plurality of multi-segment electrical interconnect traces, each multi-segment electrical interconnect trace including a first end segment, a spaced apart second end segment, and a central segment connected to the first end segment and the second end segment, the central segment oriented along the lengths of the top insulating layer and the bottom insulating layer, and the first end segment and the second end segment each extending from a side edge of the top insulating layer and the bottom insulating layer.