Molded circuit board and camera module, and manufacturing method thereof and electronic device

A method for manufacturing a molded circuit board, characterized in that it comprises the following step of:

• providing a circuit board main body and forming a molded layer of a molded structure by curing an insulating molding material on at least one surface of the circuit board main body with a molding die.

A molded circuit board, characterized in that it comprises:

• a circuit board main body, wherein the circuit board main body includes at least one circuit layer and at least one substrate layer, wherein the circuit layer and the substrate layer are stacked at intervals;
• and
• a molded structure, wherein the molded structure includes a molded layer, wherein the molded layer is stacked on at least one surface of the circuit board main body to cover at least a part of the substrate layer of the circuit board main body.