Assembly for Protecting an SMD Component from Environmental Influences
AssigneeTDK Electronics Co., Ltd.
InventorsYongli Wang, Qirong Li, Masahiro Oishi, Axel Pecina
Life of this patent
Estimating the term…
Abstract
In an embodiment an assembly includes at least one surface mounted device (SMD) component, a metallic wiring configured to lead current from the at least one SMD component to an external circuit and at least one protection element is configured to cover all outer surface of the at least one SMD component and at least parts of the metallic wiring, wherein the assembly has a structure of a molded module, and wherein the at least one SMD component includes a rechargeable all solid-state battery.
Claims16
-14. (canceled)
An assembly comprising:
- at least one surface mounted device (SMD) component;
- a metallic wiring configured to lead current from the at least one SMD component to an external circuit;
- and
- at least one protection element configured to cover all outer surface of the at least one SMD component and at least parts of the metallic wiring,
- wherein the assembly has a structure of a molded module, and
- wherein the at least one SMD component comprises a rechargeable all solid-state battery.
A method for preparing an assembly for protecting a surface mounted device (SMD) component from environmental influences, the method comprising:
- preparing the SMD component;
- applying external electrodes to the SMD component for providing an external contact of the SMD component;
- soldering a metallic wiring to the external electrodes of the SMD component to form an electric connection;
- molding the SMD component and at least pails of the metallic wiring with a protection element such that the protection element encloses the SMD component completely and such that a molded module is formed;
- leading at least a part of the metallic wiring out of the protection element;
- and
- bending and cutting the part of the metallic wiring exposed from the protection element to form an external electrode of the molded module.
An assembly comprising:
- at least one surface mounted device (SMD) component;
- a metallic wiring configured to lead current from the at least one SMD component to an external circuit;
- and
- at least one protection element configured to cover all outer surface of the at least one SMD component and at least parts of the metallic wiring,
- wherein the assembly has a structure of a molded module, and wherein the at least one SMD component comprises a rechargeable all solid-state battery,
- wherein the at least one SMD component comprises at least one external electrode and the metallic wiring comprises a first section and a second section, the first section being exposed from the at least one protection element and the second section being arranged within the at least one protection element,
- wherein the first section provides an external electrode of the assembly,
- wherein the second section is arranged on the respective external electrode, and
- wherein the first section of the metallic wiring is bent.
Dependencies are inferred from the claim text.