Method For Making Electronic Device Arrays Using A Temporary Substrate And A Carrier Substrate
AssigneeSemiLEDS Optoelectronics Co., Ltd.
InventorsDavid Trung Doan, Trung Tri Doan
Life of this patent
Estimating the term…
Abstract
A method for making light emitting device LED arrays includes the steps of providing a plurality of LEDs having a desired configuration (e.g., VLED, FCLED, PLED); attaching the LEDs to a carrier substrate and to a temporary substrate; forming one or more metal layers and one or more insulator layers configured to electrically connect the LEDs to form a desired circuitry; and separating the LEDs along with the layered metal layers and insulator layers that form the desired circuitry from the carrier substrate and the temporary substrate.
Claims16
A method for making electronic device arrays comprising:
- providing a plurality of separate electronic devices;
- providing a carrier substrate and a temporary substrate attached to the carrier substrate, the carrier substrate configured as a support substrate for supporting the electronic devices and the temporary substrate configured as an attaching substrate for attaching the electronic devices to the support substrate;
- attaching the electronic devices to the temporary substrate;
- forming one or more insulator layers on the electronic devices while attached to the temporary substrate;
- forming one or more metal layers configured to electrically connect the electronic devices to form a desired circuitry;
- and
- separating the electronic devices along with the metal layers and the insulator layers from the carrier substrate and the temporary substrate.
A method for making electronic device arrays comprising:
- providing a plurality of separate electronic devices, each electronic device comprising a bare die, a packaged device or an optical device having a desired configuration;
- providing a carrier substrate and a temporary substrate attached to the carrier substrate, the carrier substrate configured as a support substrate for supporting the electronic devices and the temporary substrate configured as an attaching substrate for attaching the electronic devices to the support substrate, wherein the temporary substrate and the carrier substrate are combined into one substrate;
- attaching the electronic devices to the temporary substrate;
- forming one or more insulator layers on the electronic devices attached to the temporary substrate;
- forming one or more metal layers on the insulator layers configured to electrically connect the electronic devices to form a desired circuitry;
- and
- separating the electronic devices along with the metal layers and the insulator layers from the carrier substrate and the temporary substrate.
A method for making electronic device arrays comprising:
- providing a plurality of separate electronic devices, each electronic device having a desired configuration with extended pads;
- providing a carrier substrate and a temporary substrate attached to the carrier substrate, the carrier substrate configured as a support substrate for supporting the electronic devices and the temporary substrate configured as an attaching substrate for attaching the electronic devices to the support substrate;
- attaching the electronic devices to the temporary substrate;
- forming a plurality of metal posts on the temporary substrate in electrical contact with the electronic devices and encapsulating the metal posts in an insulator layer;
- and
- separating the electronic devices along with the metal posts and the insulator layer from the carrier substrate and the temporary substrate.
Dependencies are inferred from the claim text.