Near-infrared light emitting semiconductor element and method for manufacturing same
AssigneeOsaka University
InventorsShuhei ICHIKAWA, Naoki YOSHIOKA, Yasufumi FUJIWARA, Jun TATEBAYASHI
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AssigneeOsaka University
InventorsShuhei ICHIKAWA, Naoki YOSHIOKA, Yasufumi FUJIWARA, Jun TATEBAYASHI
Estimating the term…
Provided are: a near infrared light-emitting semiconductor element that does not contain any harmful elements and that makes it possible to obtain near infrared light of a stable wavelength in a narrow band regardless of the operating environment; and a method for producing the near infrared light-emitting semiconductor element. GaN is used in the method for producing a near infrared light-emitting semiconductor element, and an active layer added in order to substitute Tm with Ga is formed on GaN in a reaction container at a growth rate of 0.1-30 μm/h without removal from said reaction container using an organometallic vapor phase growth method under temperature conditions of 600-1400° C. in a series of formation steps including formation of a p-type layer and an n-type layer. GaN is used in the near infrared light-emitting semiconductor element, and said near infrared light-emitting semiconductor element includes an active layer sandwiched between an n-type layer and a p-type layer on a substrate. An organometallic vapor phase growth method is used to add the active layer to the GaN in order to substitute Tm with Ga.
A method for manufacturing a near-infrared light emitting semiconductor element, wherein
A near-infrared light emitting semiconductor element which uses GaN and emits light by current injection, and which has an active layer sandwiched between an n-type layer and a p-type layer on a substrate, wherein the active layer is obtained by adding Tin to replace the Ga in GaN by using a metal organic chemical vapor deposition.
Dependencies are inferred from the claim text.