Cooling apparatus and semiconductor module

A cooling apparatus for a semiconductor module including a semiconductor chip, the cooling apparatus comprising:

• a top plate having a lower surface;
• a bottom plate disposed to have a space between the bottom plate and the lower surface of the top plate, the space functioning as a refrigerant circulation portion;
• and
• a side wall configured to connect the top plate and the bottom plate and surround the refrigerant circulation portion, wherein
• the side wall includes a fixed portion provided for at least one of the top plate and the bottom plate and fixed to the top plate or the bottom plate by a fixing material, and
• the fixed portion includes:
• an edge portion disposed to face the top plate or the bottom plate;
• and
• a separated portion adjacent to the edge portion in a first direction in which the refrigerant circulation portion and the side wall are aligned, the separated portion being disposed farther from the top plate or the bottom plate disposed to face the edge portion than the edge portion.