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US 2022/0278013 A1Published application
Electronic package with multiple electronic components spaced apart by grooves
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsHong-Da Chang, Chun-Chang Ting, Chi-Jen Chen
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Abstract
A method for fabricating an electronic package is provided. A filling material is formed in an interval S, at which a plurality of electronic components disposed on a carrying structure are spaced apart from one another. The filling material acts as a spacer having a groove, and the groove acts as a stress buffering region. Therefore, the electronic components can be prevented from being broken due to stress concentration.
Claims11
1-10. (canceled)
A method for fabricating an electronic package, comprising:
- disposing on a carrying structure a first electronic component and a second electronic component spaced apart from each other at an interval;
- forming in the interval a filling material acting as a spacer, and forming in the spacer a groove;
- and
- forming an active layer in the groove.
1 more element
Dependencies are inferred from the claim text.