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US 2022/0276558 A1Published application
Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and production method for multilayer printed wiring board
AssigneeShowa Denko Materials Co., Ltd.
InventorsKohei ABE, Mika KIMURA
Life of this patent
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Abstract
The invention relates to: a photosensitive resin composition containing: (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, (B) an epoxy resin, and (C) an active ester compound, and a method for producing it, a photosensitive resin film using the photosensitive resin composition, a multilayer printed wiring board and a method for producing it, and a semiconductor package.
Claims16
A photosensitive resin composition comprising:
- (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent,
- (B) an epoxy resin, and
- (C) an active ester compound.
Dependencies are inferred from the claim text.