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AssigneeThe 58th Research Institute of China Electronics Technology Group Corporation
InventorsJinghe Wei, Letian Huang, Zongguang Yu, Wenxu Cao, Taojie Ding, Guozhu Liu
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The invention relates to a communication method and its system between interconnected die and DSP/FPGA. The method includes multiple data interfaces. Each data interface is provided with a different protocol conversion module, wherein the data interface communication includes data input conversion and data output conversion; wherein during input conversion, the external data is converted into a unified data protocol format by protocol conversion module, which is transmitted to the network on die for unified data transmission; wherein during output conversion, the internal data is converted into different data protocol formats by protocol conversion module, and then enters different data interfaces and is transmitted to the DSP/FPGA. This method allows each device and component to be connected to the multi-die system in any form, which improves the flexibility of the system.
A communication method between interconnected die and DSP/FPGA, wherein it includes multiple data interfaces and each of the data interfaces is provided with a different protocol conversion module;
A communication system between interconnected die and DSP/FPGA, wherein the interconnected die is provided with multiple data interfaces, and the multiple data interfaces are used to connect with the DSP/FPGA;
Dependencies are inferred from the claim text.