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US 2022/0276281 A1Published application
Method of centering probe head in mounting frame
AssigneeFormFactor, Inc.
InventorsKalyanjit Ghosh, Doug Ondricek, Paul Hsiao
Life of this patent
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Abstract
A modular probe array for making temporary electrical contact to devices under test is provided. The probe array includes multiple probe heads each having a substrate disposed within a mounting block. Improved thermal cycling performance is obtained by using an O-ring between the substrate and the mounting block. Optionally, set screws can be used in combination with the O-ring to set the position of the substrate in its mounting block.
Claims4
A modular probe array for making temporary electrical contact to a device under test, comprising:
- two or more probe heads disposed on a probe card and laterally separated from each other, wherein each probe head includes a mounting block affixed to the probe card, a substrate configured to be disposed in an opening of the mounting block, and a spring-head affixed to the substrate;
- wherein each mounting block laterally surrounds its corresponding substrate;
- wherein each spring-head includes two or more vertical probes for making temporary electrical contact to the device under test;
- wherein each probe head further comprises an O-ring disposed in a lateral gap between the substrate and the mounting block.
1 more element
Dependencies are inferred from the claim text.