Board analysis supporting method and board analysis supporting system
AssigneeHitachi, Ltd.
InventorTakashi YOKOHARI
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Abstract
A board analysis supporting method comprising the following to be executed by an information processing device: board analyzing processing of setting a surface on which a component is mounted on a predetermined board, and calculating strain generated in the board from which the component has been removed, based on three-dimensional structure data indicating the board from which the component has been removed, and data indicating a predetermined force; and strain calculating processing of calculating the calculated strain on the set surface as strain of the component mounted on the set surface.
Claims7
A board analysis supporting method comprising the following to be executed by an information processing device:
- board analyzing processing of setting a surface on which a component is mounted on a predetermined board, and calculating strain generated in the board from which the component has been removed, based on three-dimensional structure data indicating the board from which the component has been removed, and data indicating a predetermined force;
- and
- strain calculating processing of calculating the calculated strain on the set surface as strain of the component mounted on the set surface.
A board analysis supporting system comprising:
- a board analysis supporting device which includes a processor and a memory, and executes:
- board analyzing processing of setting a surface on which a component is mounted on a predetermined board, and calculating strain generated in the board from which the component has been removed, based on three-dimensional structure data indicating the board from which the component has been removed, and data indicating a predetermined force, and
- strain calculating processing of calculating the calculated strain on the set surface as strain of the component mounted on the set surface.
Dependencies are inferred from the claim text.