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US 2022/0274228 A1Published application
Substrate polishing system
AssigneeKctech Co., Ltd.
InventorsHee Sung CHAE, Seung Eun LEE, Geun Sik YUN
Life of this patent
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Abstract
A substrate polishing system may include a substrate transfer unit to support a bottom surface of a substrate and transfer the substrate while forming a transfer orbit in a circle by a rotational motion, at least one carrier to perform polishing on the substrate received from the substrate transfer unit, and a loader to load the substrate which is seated on the substrate transfer unit to the carrier or unload a substrate placed on the carrier to the substrate transfer unit.
Claims16
A substrate polishing system comprising:
- a substrate transfer unit to support a bottom surface of a substrate and transfer the substrate while forming a transfer orbit in a circle by rotating;
- at least one carrier to perform polishing on the substrate received from the substrate transfer unit;
- and
- a loader to load the substrate which is seated on the substrate transfer unit to the carrier or unload a substrate placed on the carrier to the substrate transfer unit.
1 more element
Dependencies are inferred from the claim text.