Methods, system and devices for panel marking and formability measurements, including autonomous methods and devices

A method for marking of a substrate via laser etching, comprising:

• a) providing a substrate having at least one surface;
• b) designating a surface or surface portion of said at least one surface to receive marking of desired indicia;
• c) supporting the substrate on a supporting structure;
• d) positioning a laser etching device on the substrate;
• e) actuating the laser etching device to deliver a laser output that laser etches the desired indicia on the substrate surface or surface portion;
• f) wherein actuating the laser etching device to deliver the laser output that laser etches the desired indicia on the substrate surface or surface portion includes moving the laser etching device or portion thereof across the substrate surface to laser etch the desired indicia on the substrate surface;
• g) including programming operating software with a desired indicia to be etched onto the substrate surface or surface portion, wherein said software includes instructions to operate the movement of said laser etching device to produce the desired indicia on the substrate surface;
• and
• h) wherein the laser etching device is manually moved across the surface to etch each area, and wherein said laser etching device includes safety protection comprising a vacuum interlock.

A method for marking of a substrate via laser etching, comprising:

• a) providing a substrate having at least one surface;
• b) designating a surface or surface portion of said at least one surface to receive marking of desired indicia;
• c) supporting the substrate on a supporting structure;
• d) positioning a laser etching device on the substrate;
• and
• e) actuating the laser etching device to deliver a laser output that laser etches the desired indicia on the substrate surface or surface portion;
• f) wherein the desired indicia comprises a pattern usable for conducting DIC, and includes one or more codes, and wherein actuating the laser etching device to deliver a laser output that laser etches the desired indicia on the substrate surface or surface portion includes etching one or more codes on the substrate surface or surface portion along with the pattern;
• and
• g) wherein the substrate or substrate portion comprises a panel, wherein the substrate or substrate portion with the laser etched pattern is manipulated, and evaluating the pattern after the panel has been manipulated to evaluate one or more strain properties.