Electric Circuitry for Strain Measurement

An electric circuitry comprising:

• at least a first delay chain of a plurality of delay elements and at least a second delay chain of a plurality of delay elements being arranged on a substrate, the respective delay elements of the at least one first and second delay chains are configured to provide a propagation delay time depending on strain applied to the substrate,
• wherein the delay elements of the at least one first delay chain have other orientation on the substrate than the delay elements of the at least one second delay chain;
• and
• a processing circuit configured to determine a magnitude of the strain applied on the substrate based on a first signal propagation delay time of the first delay chain and a second signal propagation delay time of the second delay chain.

An electric circuitry comprising:

• at least a first ring oscillator and at least a second ring oscillator being arranged on a substrate in different orientations;
• and
• a processing circuit,
• wherein the at least one first ring oscillator comprises at least one first delay chain and the at least one second ring oscillator comprises at least one second delay chain,
• wherein the at least one first delay chain of a plurality of delay elements and the at least one second delay chain of a plurality of delay elements are arranged on the substrate,
• wherein the respective delay elements of the at least one first and second delay chains are configured to provide a propagation delay time depending on strain applied to the substrate,
• wherein the delay elements of the at least one first delay chain have other orientations on the substrate than the delay elements of the at least one second delay chain,
• wherein the at least one first ring oscillator is configured to operate with a first oscillation frequency based on a direction of the strain applied on the substrate,
• wherein the at least one second ring oscillator is configured to operate with a second oscillation frequency based on the direction of the strain applied on the substrate, and
• wherein the processing circuit is configured to determine a magnitude of the strain applied on the substrate depending on the first and second oscillation frequencies.