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US 2022/0259444 A1Published application
Coatings and primers for metallized films
AssigneeSun Chemical Corporation
InventorsAnthony Majszak, Dylan Smith
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Abstract
The present invention provides a coating composition comprising one or more polyamide resins and one or more polyethylenimine (PEI) resins, preferably dissolved in one or more solvents. When used as a primer, the coating composition of the present invention improves adhesion of subsequently printed inks and coatings to the substrate. Advantageously, the coating composition of the present invention used as a primer improves adhesion of inks and coatings to metallized film substrates.
Claims26
A coating composition comprising:
- a) one or more polyamide resins;
- b) one or more polyethylenimine resins;
- and
- c) one or more organic solvents;
- wherein the ratio of polyamide resin to polyethylenimine resin is 99.9:0.1 to 85:15, based on the total weight of the resins.
2 more elements
(canceled)
A method of priming a substrate, the method comprising:
- a) providing a substrate;
- b) providing the coating composition of 1, wherein the coating composition is a primer composition;
- c) applying one or more layers of the coating composition as the first printed layer on the substrate;
- and
- d) drying the coating composition on the substrate to provide a primed substrate.
2 more elements
Dependencies are inferred from the claim text.