Hermetic sealing structures in microelectronic assemblies having direct bonding

A microelectronic assembly, comprising:

• a first microelectronic component, having a first surface and an opposing second surface, including a conductive contact at the second surface, wherein the first microelectronic component has a first bonding surface area;
• a second microelectronic component, having a first surface and an opposing second surface, including a guard ring extending from the first surface through at least a portion of a thickness of and along a perimeter of the second microelectronic component, wherein the second surface of the first microelectronic component is electrically coupled to the first surface of the second microelectronic component via a direct bonding region, and wherein the second microelectronic component has a second bonding surface area that is smaller than the first bonding surface area;
• and
• a seal ring between the first and second microelectronic components, wherein the conductive contact at the second surface of the first microelectronic component is coupled to the guard ring at the first surface of the second microelectronic component to form the seal ring.

A microelectronic assembly, comprising:

• a first microelectronic component, having a first surface and an opposing second surface, including a guard ring extending from the second surface through at least a portion of a thickness of and along a perimeter of the first microelectronic component,
• including a conductive contact at the second surface, wherein the first microelectronic component has a first bonding surface area;
• a second microelectronic component, having a first surface and an opposing second surface, including a conductive contact at the first surface, wherein the second surface of the first microelectronic component is electrically coupled to the first surface of the second microelectronic component via a direct bonding region, and wherein the second microelectronic component has a second bonding surface area that is larger than the first bonding surface area;
• and
• a seal ring between the first and second microelectronic components, wherein the guard ring at the second surface of the first microelectronic component is coupled to the conductive contact at the first surface of the second microelectronic component to form the seal ring.