Sensor configuration for process condition measuring devices

A method of forming a process condition measurement device comprising:

• providing a substrate;
• depositing one or more insulation portions on the substrate;
• depositing a first plurality of interconnect traces on the substrate;
• depositing one or more insulation portions over the first plurality of interconnect traces;
• depositing a second plurality of interconnect traces on the substrate and over the first plurality of interconnect traces, wherein the first plurality of interconnect traces and the second plurality of interconnect traces intersect at a plurality of locations to form a matrix of interconnect junctions across one or more locations of the substrate;
• disposing a plurality of sensors on the substrate, wherein a respective sensor is electrically coupled to a respective trace of the first plurality of interconnect traces and a respective trace of the second plurality of interconnect traces, wherein the respective sensor is individually readable by addressing the respective trace of the first plurality of interconnect traces and the respective trace of the second plurality of interconnect traces.

A process condition measurement apparatus comprising:

• a substrate;
• a plurality of interconnect traces etched from a conductive foil, wherein the plurality of interconnect traces are disposed across the substrate;
• and
• a plurality of sensors, wherein a respective sensor is electrically coupled to a respective trace of the network of interconnect traces, wherein the respective sensor is individually readable by addressing the respective trace of the network of interconnect traces.

A method of forming a process condition measurement device comprising:

• providing a substrate;
• etching a plurality of interconnect traces from a conductive foil, wherein the material of the conductive foil is configured to match a thermal expansion of the substrate;
• removing the plurality of interconnect traces from the sheet of conductive foil;
• disposing the plurality of interconnect traces across the substrate;
• and
• disposing a plurality of sensors across the substrate, wherein a respective sensor is electrically coupled to a respective trace of the plurality of interconnect traces, wherein the respective sensor is individually readable by addressing the respective trace of the plurality of interconnect traces.