Substrate drying apparatus and semiconductor device manufacturing method using same

A substrate drying apparatus comprising:

• a drying chamber configured to load a substrate and including a lower chamber and an upper chamber above the lower chamber;
• a supply port configured to introduce a supercritical fluid into the drying chamber and including a main supply port and a sub-supply port horizontally spaced apart from the main supply port, wherein the main supply port penetrates a center portion of the upper chamber;
• and
• a pressure meter configured to measure pressure of the supercritical fluid in the drying chamber and generate a measured pressure value,
• wherein the supercritical fluid is introduced into the drying chamber through the sub-supply port during a first time period, and the supercritical fluid is introduced into the drying chamber through the main supply port during a second time period following the first time period.

A substrate drying apparatus comprising:

• a drying chamber configured to load a substrate and including a lower chamber and an upper chamber above the lower chamber;
• a supply port configured to supply a supercritical fluid into the drying chamber and including a main supply port and a sub-supply port horizontally spaced apart from the main supply port, wherein the main supply port penetrates a center portion of the upper chamber;
• and
• a first buffer member coupled to the upper chamber, vertically separated from the sub-supply port, and vertically overlapping the sub-supply port, such that supercritical fluid vertically introduced into the drying chamber through the sub-supply port is impeded by the first buffer member to change a flow direction for the supercritical fluid.