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US 2022/0177727 A1Published application
Polishing slurry composition for sti process
AssigneeKctech Co., Ltd.
InventorsJung Yoon KIM, Jun Ha HWANG, Kwang Soo PARK, Hae Won YANG
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Abstract
The present disclosure relates to a polishing slurry composition for an STI process and, more specifically, to a polishing slurry composition for an STI process, the polishing slurry composition comprising: a polishing solution including polishing particles; and an additive solution containing a polymer having an amide bond, and a polysilicon film polishing barrier inclusive of a monomer having three or more chains linked to one or more atoms.
Claims17
A polishing slurry composition for a shallow trench isolation (STI) process, the polishing slurry composition comprising:
- a polishing solution comprising abrasive particles;
- and
- an additive solution,
- wherein the additive solution comprises a polysilicon film polishing inhibitor comprising a polymer having an amide bond, and a monomer having three or more chains linked to one or more atoms.
1 more element
Dependencies are inferred from the claim text.