Low stress integrated device package
AssigneeAnalog Devices, Inc.
InventorsYeonsung Kim, Shafi Saiyed, Thomas M. Goida
Life of this patent
Estimating the term…
Abstract
An integrated device package is disclosed. The integrated device package can include a package housing that defines a cavity. The integrated device package can include an integrated device die that is disposed in the cavity. The integrated device die has a first surface includes a sensitive component. A second surface is free from a die attach material. The second surface is opposite the first surface. The integrated device die include a die cap that is bonded to the first surface. The integrated device package can also include a supporting structure that attaches the die cap to the package housing.
Claims20
An integrated device package comprising:
- a package housing defining a cavity;
- an integrated device die disposed in the cavity, the integrated device die having a first surface comprising a sensitive component and a second surface opposite the first surface, the integrated device die comprising a die cap bonded to the first surface over the sensitive component;
- a carrier disposed in the cavity and electrically connected to the package housing, the carrier mounted to a portion of the package housing;
- and
- a support structure attached to the die cap, the support structure mechanically coupling the die cap and the package housing.
An integrated device package comprising:
- a package housing defining a cavity, the package housing having a first region and a second region different from the first region;
- a first integrated device die disposed in the cavity, the first integrated device die having a first surface facing the first region and a second surface facing away from the first region, the first surface including a sensitive component, the first integrated device die comprising a die cap bonded to the first surface over the sensitive component;
- and
- a second integrated device die disposed in the cavity and mounted to the second region of the package housing.
An integrated device package comprising:
- an integrated device die having a first surface comprising a sensitive component, and a second surface opposite the first surface, the integrated device die comprising a die cap attached to the first surface and protecting the sensitive component;
- and
- a support beam attached to the die cap, the support beam partially covering an upper surface of the die cap, and the support beam configured to couple the integrated device die to a package housing.
Dependencies are inferred from the claim text.