Bonding system

Abstract

A water-based adhesive film-forming cover composition including: (i) at least one film forming polymer; (ii) at least one lower crystallinity first polynitroso compound; (iii) at least one higher crystallinity second polynitroso compound; (iv) at least one crosslinking agent; and (v) water as a carrier liquid; a bonding system including a combination of: (a) a water-based primer component; and (b) the above water-based cover component; a process for manufacturing the above bonding system; and a process of manufacturing bonded article with the above bonding system. A bonded article, having a bonding line made from the above bonding system disposed between metal and rubber substrates, exhibits excellent stability against an aqueous urea-solution at temperatures of up to about 95° C.

Dependencies are inferred from the claim text.