Multi-loop cooling configuration for high-density server racks
AssigneeBaidu USA LLC
InventorTianyi GAO
Life of this patent
Estimating the term…
Loading patent…
AssigneeBaidu USA LLC
InventorTianyi GAO
Estimating the term…
Embodiments are disclosed of a cooling unit. The cooling unit includes a unit inlet, an open-loop outlet, and a closed-loop outlet. A fluid bypass line having a first three-way valve and a second three-way valve is fluidly coupled to the unit inlet and is fluidly coupled by the second three-way valve to the open-loop outlet and the closed-loop outlet. A main cooling loop is fluidly coupled to the fluid bypass line. The main cooling loop includes a heat exchanger having an inlet and an outlet. The inlet of the heat exchanger is fluidly coupled by a supply line to the fluid bypass line at or near the unit inlet, and the outlet of the heat exchanger is coupled by a return line to the fluid bypass line between the first three-way valve and the second three-way valve. A pump is fluidly coupled in the return line and a two-way line is fluidly coupled to the first three-way valve and to the return line upstream of the pump. Different system loop designs and operation modes are configured by adjusting the three way valves and bidirectional loops.
A cooling unit comprising:
A cooling system comprising:
A process comprising:
Dependencies are inferred from the claim text.