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US 2022/0102887 A1Published application
Compression mounted technology (cmt) socket retention mechanisms to board or interposer
AssigneeIntel Corporation
InventorsFeifei CHENG, Thomas BOYD, Kuang LIU, Steven A. KLEIN, Daniel NEUMANN, Mohanraj PRABHUGOUD
Life of this patent
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Abstract
Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.
Claims20
A socket, comprising:
- a housing with a first surface and a second surface;
- a plurality of interconnect pins passing through the housing;
- an alignment hole through the housing;
- and
- an alignment post extending out from the first surface of the housing.
2 more elements
An electronic package, comprising:
- a substrate, wherein the substrate comprises a first alignment hole;
- an alignment standoff extending up from the substrate;
- and
- a socket attached to the substrate, wherein the socket comprises:
- a housing;
- an alignment post extending out from the housing, wherein the alignment post is inserted into the first alignment hole;
- and
- a second alignment hole, wherein the alignment standoff is inserted into the second alignment hole.
5 more elements
An electronic system, comprising:
- a substrate with an alignment standoff and a first alignment hole;
- a socket attached to the substrate, wherein the socket is aligned to the substrate with a protrusion that inserts into the first alignment hole, and wherein the alignment standoff passes through a second alignment hole in the socket, and wherein an entrance to the second alignment hole is tapered.
Dependencies are inferred from the claim text.