Method, electronic apparatus, and system for defect detection

A system for defect detection in an electronic apparatus, the system comprising:

• the electronic apparatus including:
• a substrate block;
• an electronic device mounted on the substrate block;
• a bonding layer positioned between the electronic device and the substrate block to bond the electronic device to the substrate block;
• and
• one or more piezoelectric devices attached to one of the electronic device and the bonding layer, a first subset of the one or more piezoelectric devices being configured to transmit one or more acoustic signals, a second subset of the one or more piezoelectric devices being configured to receive the one or more acoustic signals;
• and
• a controller including processing circuitry, the processing circuitry being configured to:
• determine a measurement configuration for the one or more piezoelectric devices, the measurement configuration indicating the first subset and the second subset of the one or more piezoelectric devices;
• perform a defect measurement on the electronic apparatus by implementing the measurement configuration for the first subset and the second subset;
• and
• determine whether at least one mechanical defect is located in at least one of (i) the bonding layer, (ii) the electronic device, (iii) the substrate block, (iv) a first interface between the bonding layer and the electronic device, and (v) a second interface between the electronic device and the substrate block based on the received one or more acoustic signals.

A method for defect detection in an electronic apparatus, the method comprising:

• determining a measurement configuration for one or more piezoelectric devices in the electronic apparatus, the electronic apparatus including a substrate block, an electronic device mounted on the substrate block using a bonding layer, and the one or more piezoelectric devices being attached to one of the electronic device and the bonding layer;
• performing, based on the measurement configuration, a defect measurement on the electronic apparatus by causing a first subset of the one or more piezoelectric devices to transmit one or more acoustic signals and causing a second subset of the one or more piezoelectric devices to receive the one or more acoustic signals;
• and
• determining whether at least one mechanical defect is located in at least one of (i) the bonding layer, (ii) the electronic device, (iii) the substrate block, (iv) a first interface between the bonding layer and the electronic device, and (v) a second interface between the electronic device and the substrate block based on the received one or more acoustic signals.