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US 2022/0102317 A1Published application
Thermal transfer structures for semiconductor die assemblies
AssigneeMicron Technology, Inc.
InventorEd A. Schrock
Life of this patent
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Abstract
Several embodiments of the present technology are described with reference to a semiconductor apparatus. In some embodiments of the present technology, a semiconductor apparatus includes a stack of semiconductor dies attached to a thermal transfer structure. The thermal transfer structure conducts heat away from the stack of semiconductor dies. Additionally, the assembly can include molded walls to support the thermal transfer structure.
Claims20
A semiconductor die assembly, comprising:
- a support substrate;
- a base semiconductor die on the support substrate;
- two or more semiconductor dies stacked on the base semiconductor die;
- a molded wall having parallel vertical surfaces on opposing sides of the stacked two or more semiconductor dies and at least partially defining a cavity spaced apart from the stacked two or more semiconductor dies, and wherein the molded wall extends upward from the support substrate;
- and
- a thermal transfer structure (TTS) over and directly attached to a top portion of the molded wall, wherein
- the TTS at least partially defines an upper boundary for the cavity and is configured to dissipate heat away from the base semiconductor die and the stacked two or more, semiconductor dies,
- the TTS further comprising a first portion extending in a first direction and a second portion extending in a second direction, wherein (1) the first and second directions are different, and (2) the second portion is directly coupled to the base semiconductor die via an adhesive.
5 more elements
A semiconductor die assembly, comprising:
- a support substrate;
- a base semiconductor die on the support substrate;
- two or more semiconductor dies stacked on the base semiconductor die;
- a molded wall having parallel vertical surfaces on opposing sides of the stack of two or more semiconductor dies which at least partially define a cavity spaced apart from the stacked two or more semiconductor dies, wherein (1) the stacked two or more semiconductor dies is received in the cavity and spaced apart from the molded material and (2) the molded material extends upward from the support substrate;
- a thermal transfer lid having a first portion over and directly attached to a top portion of the molded material and a second portion extending from the first portion, wherein
- the second portion of the thermal transfer lid is attached to the base semiconductor die and the thermal transfer lid at least partially defines an upper boundary for the cavity,
- the second portion of the thermal transfer lid is attached to a peripheral region of the first die located on the bottom of the stack, and
- the peripheral region extends beyond the stack of two or more semiconductor dies in the stack.
5 more elements
A semiconductor apparatus, comprising:
- a base semiconductor die;
- at least one semiconductor die stacked on top of the base semiconductor die;
- a molded wall having parallel vertical surfaces on opposing sides of the at least one stacked semiconductor die and at least partially defining a cavity spaced apart from the at least one stacked semiconductor die, wherein the molded wall extends upward;
- and
- a thermal lid and directly attached to a top portion of the molded wall, wherein
- the thermal lid at least partially defines an upper boundary for the cavity and is configured to dissipate heat away from the first semiconductor die and the plurality of second semiconductor dies, and
- the thermal lid includes at least two portions that protrude along different directions, wherein one of the two portions is directly attached to the base semiconductor die.
4 more elements
Dependencies are inferred from the claim text.