Electronic Device and Method for Assembling an Electronic Device
AssigneeZF Friedrichshafen AG
InventorsMaximilian Olpp, Danny Grusser, Boris Heberle
Life of this patent
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Abstract
An electronic device includes at least one electronic module (CHIP) arranged on a printed circuit plate (LP) and, on the top side, is connected to a heat sink (HS) in a force-free manner. A method for assembling an electronic device includes assembling a printed circuit plate (LP), which is provided with at least one electronic module (CHIP), with a heat sink (HS) for dissipating heat from the at least one electronic module (CHIP). The connection between the heat sink (HS) and the at least one electronic module (CHIP) is established in a force-free manner.
Claims13
1-12:
- (canceled)
An electronic device, comprising
- a printed circuit board (LP);
- at least one electronic module (CHIP) arranged on the printed circuit plate (LP);
- and
- a heat sink (HS),
- wherein the at least one electronic module (CHIP) is connected to the heat sink (HS) in a force-free manner on a top side of the at least one electronic module (CHIP).
A method for assembling an electronic device, comprising:
- assembling a printed circuit plate (LP), which is provided with at least one electronic module (CHIP), with a heat sink (HS) for dissipating heat from the at least one electronic module (CHIP),
- wherein a connection between the heat sink (HS) and the at least one electronic module (CHIP) is established in a force-free manner.
Dependencies are inferred from the claim text.