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AssigneeSCREEN Holdings Co., Ltd.
InventorsAkira Horikoshi, Miyoshi UENO, Yayoi TAKEICHI, Takaaki YANAGIDA, Kenji NAKANISHI, Shigeru TAKATSUJI, Takahiro KIMURA
Estimating the term…
A substrate processing method includes: supplying a processing solution onto the upper surface of the substrate; executing, under atmospheric pressure, plasma processing on a liquid film of the processing solution that is formed at least in part of the upper surface of the substrate, with a thickness of the liquid film being a first thickness; and executing, under atmospheric pressure, plasma processing on the liquid film of the processing solution that is formed at least in part of the upper surface of the substrate, with the thickness of the liquid film being a second thickness, in which the first thickness is smaller than the second thickness. Thus, resists on the upper surface of the substrate can be efficiently removed.
A substrate processing method of removing a resist from an upper surface of a substrate, said substrate processing method comprising:
Dependencies are inferred from the claim text.