Electronic module

Abstract

An electronic module includes a wiring board including a lower surface on which a second electrode pad including a bonding surface is located, a lead electrically connected to the second electrode pad with solder therebetween, and a sealer to seal the lead. The lead includes an exposed section exposed to outside the sealer and a main body section extending from the exposed section toward the wiring board and including a tip end portion near the wiring board. The tip end portion is connected to the second electrode pad with the solder therebetween. A thickness of the solder between a tip end surface of the tip end portion and the bonding surface of the second electrode pad in a direction orthogonal or substantially orthogonal to the bonding surface is non-uniform.

Dependencies are inferred from the claim text.