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US 2022/0093465 A1Published application
High Efficiency Die Dicing and Release
Assignee3D Glass Solutions, Inc.
InventorsMark Popovich, Roger Cook, Jeb H. Flemming, Sierra D. Jarrett, Jeff Bullington, Carrie F. Schmidt, Luis C. Chenoweth
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Abstract
A method of batch massively parallel die release of a die from a substrate enabling low cost mass production of with passive, system in package (SiP) or system-in-a-package, or systems-on-chip (SoC), filters and/or other devices from a glass substrate.
Claims22
A method of creating a die release or scribe pattern for one or more dies in parallel batch process from a substrate comprising:
- exposing at least one portion of a photosensitive glass substrate with the die release or scribe pattern with an activating UV energy source;
- heating the photosensitive glass substrate to a heating phase for at least ten minutes above its glass transition temperature;
- cooling the photosensitive glass substrate to transform at least part of the exposed photosensitive glass substrate to a crystalline material to form a glass-ceramic crystalline substrate;
- coating an exposed region with a UV light blocking layer;
- creating a passive component, filter, or other device to completion on a front of the substrate;
- and
- etching away a ceramic phase of the die release or scribe pattern in the photosensitive glass substrate with an etchant solution to release the die from the substrate.
4 more elements
A method of creating a die release or scribe pattern for one or more dies in parallel batch process from a substrate comprising:
- masking a photosensitive glass substrate with the die release or scribe pattern;
- exposing at least one portion of the photosensitive glass substrate as a die release with an activating UV energy source;
- heating the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature;
- cooling the photosensitive glass substrate to transform at least part of the exposed photosensitive glass substrate to form a glass-ceramic crystalline portion of the photosensitive glass substrate;
- coating an exposed region with a UV light blocking layer;
- creating a passive component, filter, or other device to completion;
- placing a weakly adhesive backing to a back side of the substrate;
- etching away the glass-ceramic portion of the die release or scribe pattern in the photosensitive glass substrate with an etchant solution that releases the die;
- and
- removing the one or more dies from the weakly adhesive backing.
7 more elements
Dependencies are inferred from the claim text.