Interconnect structures including self aligned vias

An interconnect structure for an integrated circuit, the interconnect structure comprising:

• a first interconnect structure disposed above a substrate, the first interconnect structure comprising a metal line formed in a first interlayer dielectric;
• and
• a second interconnect structure disposed above the first interconnect structure, the second interconnect structure comprising:
• a third cap layer selectively provided on only the metal line of the first interconnect structure;
• a second cap layer on the first interlayer dielectric and the third cap layer, wherein the third cap layer comprises an insulating material or a metal material, and wherein the second cap layer is an insulating material;
• a second interlayer dielectric thereon;
• and
• at least one self-aligned via conductively coupled to at least a portion of the metal line of the first interconnect structure, wherein a misalignment of the at least one self-aligned via results in the at least one self-aligned via conductively coupled to the metal line of the first interconnect structure and on the second cap layer.