Electrostatic chuck having a heating and chucking capabilities

A processing region comprising:

• a pedestal assembly configured to move between a loading position and a processing position, the pedestal assembly comprising a substrate support comprising first pins coupled to a first power supply and second pins coupled to a second power supply;
• and
• an electrostatic chuck comprising:
• a chuck body having a top surface configured to support a substrate and a bottom surface opposite the top surface and configured to be supported by the substrate support, wherein the chuck body comprises:
• one or more chucking electrodes;
• and
• one or more heating elements;
• first terminals disposed on the bottom surface of the chuck body and coupled with the one or more heating elements, the first terminals are configured mate with the first pins of the substrate support;
• second terminals disposed on the bottom surface of the chuck body and coupled with the one or more chucking electrodes, the second terminals are configured to mate with the second pins of the substrate support;
• and
• third terminals disposed on the bottom first surface of the chuck body and coupled with the one or more chucking electrodes.

A cluster tool assembly comprising:

• a processing region comprising:
• a pedestal assembly configured to move between a loading position and a processing position, the pedestal assembly comprising a substrate support comprising first pins coupled to a first power supply and second pins coupled to a second power supply;
• and
• an electrostatic chuck comprising:
• a chuck body having a top surface configured to support a substrate and a bottom surface opposite the top surface and configured to be supported by the substrate support, wherein the chuck body comprises:
• one or more chucking electrodes;
• and
• one or more heating elements;
• first terminals disposed on the bottom surface of the chuck body and coupled with the one or more heating elements, the first terminals are configured mate with the first pins of the substrate support;
• second terminals disposed on the bottom surface of the chuck body and coupled with the one or more chucking electrodes, the second terminals are configured to mate with the second pins of the substrate support;
• and
• third terminals disposed on the bottom first surface of the chuck body and coupled with the one or more chucking electrodes.