Semiconductor manufacturing apparatus, substrate transfer method, and program
AssigneeTokyo Electron Limited
InventorsToshiharu Hirata, Takafumi Matsuhashi, Kunio Takano, Minoru Nagasawa
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AssigneeTokyo Electron Limited
InventorsToshiharu Hirata, Takafumi Matsuhashi, Kunio Takano, Minoru Nagasawa
Estimating the term…
A semiconductor manufacturing apparatus including a plurality of process modules for performing desired processes on a plurality of substrates and a plurality of transfer modules for serially transferring the plurality of substrates to the plurality of process modules is provided. The semiconductor manufacturing apparatus comprises a scheduler for calculating a cycle time so that a difference in time required for each of the desired processes is within an allowable time range and generating a transfer plan for the plurality of substrates based on the cycle time, and a transfer controller for controlling the plurality of transfer modules so that the plurality of substrates are serially transferred to the process modules according to the generated transfer plan.
A semiconductor manufacturing apparatus including a plurality of process modules for performing desired processes on a plurality of substrates and a plurality of transfer modules for serially transferring the plurality of substrates to the plurality of process modules, the semiconductor manufacturing apparatus comprising:
A substrate transfer method of a semiconductor manufacturing apparatus including a plurality of process modules for performing desired processes on a plurality of substrates and a plurality of transfer modules for serially transferring the plurality of substrates to the plurality of process modules, the substrate transfer method comprising:
A program causing a semiconductor manufacturing apparatus including a plurality of process modules for performing desired processes on a plurality of substrates and a plurality of transfer modules for serially transferring the plurality of substrates to the plurality of process modules to:
Dependencies are inferred from the claim text.