Packaging structure and method for preparing same

A method for preparing a chip packaging structure, comprising:

• providing a glass substrate, wherein the glass substrate comprises recesses therein;
• forming metal connecting posts in the recesses, wherein each of the metal connecting posts comprises a first end in contact with the glass substrate and a second end opposite to the first end;
• packaging the recesses and the metal connecting posts with a first packaging layer, wherein the second ends of the metal connecting posts are configured to be exposed from the first packaging layer;
• forming a connection layer on the glass substrate, wherein the connection layer comprises metal bumps and a dielectric layer, wherein the metal bumps electrically connect to the metal connecting posts and the dielectric layer covers the first packaging layer and the glass substrate;
• providing semiconductor chips, wherein the semiconductor chips are disposed on the connection layer, wherein front sides of the semiconductor chips are electrically connected to the metal bumps via chip pads, and wherein back sides of the semiconductor chips face away from the glass substrate;
• filling a gap between the semiconductor chips and the connection layer with a filler layer, wherein the filler layer encloses the front sides of the semiconductor chips and the metal bumps;
• packaging the connection layer and semiconductor chips with a second packaging layer;
• removing a portion of the glass substrate to expose the first ends of the metal connecting posts;
• forming a controlled collapse chip connection (C4) layer, wherein the C4 layer comprises a wiring layer and first solder bumps, wherein the wiring layer is electrically connected to the metal connecting posts;
• thinning the second packaging layer to expose the back sides of the semiconductor chips to form a package body;
• providing a base substrate, wherein the package body is electrically connected to the base substrate through the first solder bumps;
• and
• providing a heat sink housing, wherein the heat sink housing is disposed on the base substrate and encloses the package body, and wherein a bottom of the heat sink housing is in contact with the package body.