Method of manufacture including polishing pad monitoring method and polishing apparatus including polishing pad monitoring device

A polishing apparatus, comprising:

• a polishing pad conditioner including a conditioner disk which is rotatable and configured to condition a polishing surface of a polishing pad;
• a non-contacting displacement sensor arranged to face an upper surface of the conditioner disk and configured to detect a displacement of the conditioner disk while the conditioner disk rotates;
• and
• a data processor configured to calculate a height of the conditioner disk from displacement detected by the non-contacting displacement sensor and configured to determine a height of the polishing pad or a failure of the polishing pad conditioner including the conditioner disk,
• wherein the non-contacting displacement sensor comprises an eddy current sensor,
• wherein the data processor comprises:
• a data receiver configured to receive an output signal from the eddy current sensor;
• a data converter configured to convert the output signal into two-dimensional plane profile data of a constant displacement and to convert the output signal into height data of a two-dimensional plane;
• and
• a calculator configured to calculate the height of the conditioner disk based on the two-dimensional plane profile data and the height data, and
• wherein the data converter is configured to perform an offset compensation to convert data of voltage signals into the two-dimensional plane profile data using singular points obtained from indexing structures on the upper surface of the conditioner disk.