Multipoint contact conduction cooling of a removable device

An electronic system comprising:

• a host device comprising a thermal management unit and a host circuit board having a connector, wherein the thermal management unit comprises:
• a cooling component coupled to a portion of the host circuit board, comprising a partially protruded portion;
• and
• a plurality of spring fingers spaced apart from each other, wherein each of the plurality of spring fingers comprises a first end coupled to the partially protruded portion, and a second end having a dry contact surface;
• and
• a removable device comprising:
• a circuit board communicatively coupled to the host circuit board via the connector;
• a plurality of electronic components coupled to a portion of the circuit board, wherein the circuit board and the plurality of electronic components generates a waste-heat;
• and
• a heat spreader coupled to at least one or more electronic components and the portion of the circuit board, wherein the heat spreader dissipates the waste-heat to a peripheral surface of the heat spreader, and
• wherein the dry contact surface establishes a direct thermal interface with the peripheral surface to transfer the waste-heat from the removable device to the cooling component through each spring finger.

A method comprising:

• plugging a removable device into a host device to communicatively couple a circuit board of the removable device to a host circuit board of the host device through a connector,
• wherein the host device comprises a thermal management unit having a plurality of spring fingers, and a cooling component coupled to a portion of the host circuit board comprising a partially protruded portion, wherein each spring finger comprises a first end coupled to the partially protruded portion, and a second end having a dry contact surface, and
• wherein the removable device comprises a heat spreader coupled to the removable circuit board to dissipate waste-heat to a peripheral surface of the heat spreader;
• establishing a direct thermal interface between the dry contact surface and the peripheral surface by deflecting the second end of each spring finger towards the cooling component and exerting a spring force on the peripheral surface;
• dissipating the waste-heat generated by the removable device to the peripheral surface;
• and
• transferring the waste-heat from the removable device to the cooling component via the plurality of spring fingers.