Optical scanning device and method for manufacturing same
AssigneeMitsubishi Electric Corporation
InventorsYoshitaka KAJIYAMA, Yoshiaki HIRATA, Yusuke SHIRAYANAGI, Kozo ISHIDA
Life of this patent
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Abstract
An optical scanning device includes a first structure and a second structure. The first structure includes a support, a driver, a first columnar body, a driving section, and a pair of beams. The support includes a support body and a flat section. The pair of beams connects the driver and the flat section. The driving section includes a coil, a pair of electrode pads, and a magnet. The second structure is provided with a reflector.
Claims16
An optical scanning device comprising:
- a first structure and
- a second structure, wherein
- the first structure includes:
- a support, wherein the support includes a support body and a flat section connected to the support body and extending further outward from an outer periphery of the support body;
- a beam connected to the flat section;
- a driver rotatably connected to the flat section with the beam interposed therebetween;
- a first columnar body connected to the driver and having a height corresponding to a thickness of the support body;
- and
- a driving section configured to rotate the driver using the beam as an axis, the second structure includes:
- a reflector disposed so as to face the support;
- and
- a second columnar body connected to the reflector and connected to the first columnar body, and
- the beam is disposed in a part, opposite to a side where the second structure is disposed, in the support.
2-15. (canceled)
A method for manufacturing an optical scanning device including a first structure and a second structure, wherein
- forming the first structure includes:
- preparing a first substrate in which a first semiconductor layer, a first insulating film, a second semiconductor layer, and a second insulating film are sequentially stacked;
- forming a driving section on a side of the second insulating film in the first substrate;
- processing the second insulating film and the second semiconductor layer, and forming a driver driven by the driving section, a flat section, and a beam connecting the driver and the flat section by respective parts of the second insulating film and the second semiconductor layer;
- and
- processing the first semiconductor layer and the first insulating film, and forming a support including a support body connected to the flat section and a first columnar body connected to the driver by respective parts of the first insulating film and the first semiconductor layer,
- forming the support body connected to the flat section includes forming the support body so that the flat section extends further outward from an outer periphery of the support body,
- forming the first columnar body includes forming the first columnar body having a height corresponding to a thickness of the support body, forming the second structure includes:
- preparing a second substrate in which a third semiconductor layer, a third insulating film, a fourth semiconductor layer, and a fourth insulating film are sequentially stacked;
- and
- processing the third semiconductor layer and the third insulating film, forming a reflector by respective parts of the fourth semiconductor layer and the fourth insulating film, and forming a second columnar body connected to the reflector by respective parts of the third semiconductor layer and the third insulating film, and
- the method comprises bonding the first columnar body and the second columnar body such that the reflector faces the support after the first structure and the second structure are formed.
Dependencies are inferred from the claim text.