Method of manufacturing an integrated circuit involving performing an electrostatic discharge test and electrostatic discharge test system performing the same

An electrostatic discharge (ESD) test system comprising:

• a first tester configured to sequentially radiate a plurality of first electromagnetic waves on a first test board including a device under test (DUT), and configured to sequentially radiate the plurality of first electromagnetic waves on a second test board including an electromagnetic wave receiving module;
• a second tester configured to radiate a second electromagnetic wave on a housing including a third test board including the electromagnetic wave receiving module;
• and
• an automatic test equipment configured to
• detect a weak frequency band associated with the DUT based on sequentially radiating the plurality of first electromagnetic waves on the first test board,
• detect a first peak-to-peak voltage signal associated with the DUT based on sequentially radiating the plurality of first electromagnetic waves on the second test board,
• detect a frequency spectrum based on radiating the second electromagnetic wave on the housing,
• generate a second peak-to-peak voltage signal based on the weak frequency band, the first peak-to-peak voltage signals and the frequency spectrum, and
• predict an ESD characteristic associated with an electronic system including the DUT based on the second peak-to-peak voltage signal.

A method of performing an electrostatic discharge (ESD) test, the method comprising:

• detecting a weak frequency band by sequentially radiating a plurality of first electromagnetic waves on a first test board including a device under test (DUT);
• detecting first peak-to-peak voltage signals by sequentially radiating the plurality of first electromagnetic waves on a second test board including an electromagnetic wave receiving module;
• detecting a frequency spectrum by radiating a second electromagnetic wave on a housing including a third test board including the electromagnetic wave receiving module;
• generating a second peak-to-peak voltage signal based on the weak frequency band, the first peak-to-peak voltage signals and the frequency spectrum;
• predicting an ESD characteristic associated with an electronic system including the DUT based on the second peak-to-peak voltage signal;
• and
• generating a database with respect to the DUT,
• wherein the DUT is mounted at a first position on the first test board, the electromagnetic wave receiving module is mounted at a second position on the second test board, and the electromagnetic wave receiving module is mounted at a test position on the third test board, and
• wherein the test position is determined based on a design of the electronic system including the DUT.