Wafer type sensor unit and data acquisition method using the wafer type sensor unit
AssigneeSemes Co., Ltd.
InventorsYong-Jun SEO, Sang Hyun SON, Ji Su HONG, Jae Myoung LEE, Dong Ok AHN
Life of this patent
Estimating the term…
Abstract
The inventive concept provides a wafer type sensor unit which acquires data on a wind direction and a wind velocity of an air flow during processing, the wafer type sensor unit supported by a supporting unit of a substrate processing apparatus. The unit comprising a wafer-shaped circuit board and a hot-wired wind velocity sensor placed apart from an upper surface of the circuit board.
Claims18
A wafer type sensor unit for acquiring data on a wind direction and a wind velocity of an air flow during processing, the wafer type sensor unit supported by a supporting unit of a substrate processing apparatus,
- the wafer type sensor unit comprising:
- a wafer-shaped circuit board;
- and
- a hot-wired wind velocity sensor placed apart from an upper surface of the circuit board.
A wafer type sensor unit for acquiring data on a wind direction and a wind velocity of an air flow during processing, the wafer type sensor unit supported by a supporting unit of a substrate processing apparatus, the wafer type sensor unit comprising:
- a wafer-shaped circuit board;
- and
- an electronic device installed on an upper surface of the circuit board and coated with a coating layer, wherein the height of the coating layer from the upper surface of the circuit board is constant;
- and
- a hot-wired wind velocity sensor placed apart from an upper surface of the coating layer.
(canceled)
(canceled)
Dependencies are inferred from the claim text.