Composition for surface treatment, method for producing the same, surface treatment method, and method for producing semiconductor substrate
AssigneeFujimi Incorporated
InventorsKeita SUZUKI, Yohei TAKAHASHI
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AssigneeFujimi Incorporated
InventorsKeita SUZUKI, Yohei TAKAHASHI
Estimating the term…
The present invention provides a means capable of improving a residue removing effect and improving storage stability in a composition for surface treatment which is used for reducing residues on a surface of an object to be polished after being polished chemical mechanical polishing. The present invention relates to a composition for surface treatment, wherein the composition contains a solvent and a dissolved gas, a concentration of the dissolved gas is 0.01 mg/L or more and 10 mg/L or less with respect to a total volume of the composition and the composition is used for reducing residues on a surface of an object to be polished after being polished by chemical mechanical polishing.
A composition for surface treatment,
Dependencies are inferred from the claim text.