Electrospun Cover Layer for Medical Implants

Abstract

A medical implant for enhanced durability and wear reduction is provided that distinguishes a medical implant support structure, an electrospun cover layer covering at least a portion of the medical implant support structure, and an electrospun medical implant layer covering the electrospun cover layer such that the electrospun cover layer is an in-between layer in between the portion of the medical implant support structure and the electrospun medical implant layer. Such implant prevents direct contact for the medical implant support structure with the electrospun medical implant layer and thereby ensures that the electrospun cover layer is in direct contact with the electrospun medical implant layer.

Dependencies are inferred from the claim text.