Cutting element
AssigneeGebrüder Busatis Gesellschaft m.b.H.
InventorWolfgang Lutz
Life of this patent
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AssigneeGebrüder Busatis Gesellschaft m.b.H.
InventorWolfgang Lutz
Estimating the term…
A cutting element, in particular for abrasive cut material, is provided that includes a substrate that defines at least one cutting wedge which is formed by first and second wedge surfaces that intersect along a wedge edge. A cutting layer that extends over the first wedge surface and defines a cutting edge which lies on the wedge edge when new. The wear resistance of the cutting layer is greater than wear resistance of the substrate. The cutting layer is configured to define a blade-shaped protrusion that projects beyond the wedge edge due to wear of the substrate in the area of the second wedge surface to provide a self-resharpening cutting edge. The cutting layer or part thereof is formed by means of melt-metallurgical modification of an edge zone of the substrate by in-situ precipitation of finely dispersed inherent hard phases from partial melting of the edge zone of the substrate.
A cutting element, comprising:
A method for manufacturing a cutting element, comprising:
Dependencies are inferred from the claim text.