Method for Manufacturing a Circuit Having a Lamination Layer Using Laser Direct Structuring Process

A method of forming a multi-layer circuit on a curved substrate, the method comprising:

• forming, by a laser direct structuring process, a first layer of the multi-layer circuit on a first surface of the curved substrate;
• applying a first layer of paint to the first layer of the multi-layer circuit;
• and
• forming, by the laser direct structuring process, a second layer of the multi-layer circuit on the first layer of the paint, the second layer of the multi-layer circuit being electrically coupled to the first layer of the multi-layer circuit.

An electronic device comprising:

• a curved substrate;
• a first layer of a multi-layer circuit, the first layer disposed on a first surface of the curved substrate;
• a first layer of paint disposed on the first layer of the multi-layer circuit;
• a second layer of the multi-layer circuit, the second layer disposed on the first layer of paint.