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AssigneeBombardier Transportation GmbH
InventorsBen DIEDRICHS, Tommy RANDOW
Estimating the term…
An arrangement for cooling power semiconductor devices (2) of a converter (1) arranged in a closed casing (3) with the semiconductor devices in a bottom of the casing on top of a heat sink (5) having members (6) for heat exchange extending externally of the casing out from the bottom comprises a channel (8) for conducting a flow of air to pass said members (6) for cooling thereof, in which a first portion (7) of the channel has the casing bottom as a ceiling and receiving said members (6). A fan (9) is located with a suction side connected to the first channel portion (7) to create a flow of air from an inlet (16) from the exterior (19) into the channel while passing the heat sink members. A filter (18) covers the inlet to the channel for removal of dust and debris from air entering the channel from the exterior.
An arrangement for cooling power semiconductor devices (2) of a converter (1) arranged in a closed casing (3) with said semiconductor devices in a bottom (4) of the casing on top of a heat sink (5) having members (6), such as fins, for heat exchange extending externally of the casing out from the bottom, the arrangement comprising:
Dependencies are inferred from the claim text.