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US 2022/0071061 A1Published application
Tubular heat spreaders for memory modules and memory modules incorporating the same
AssigneeMicron Technology, Inc.
InventorsThomas H. Kinsley, George E. Pax, Yogesh Sharma, Gregory A. King, Chan H. Yoo, Randon K. Richards
Life of this patent
Estimating the term…
Abstract
Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. An apparatus may have a printed circuit board (PCB) having an edge connector. At least one integrated circuit device may be disposed on a surface of the PCB. A tubular heat spreader may be disposed along an edge of the PCB opposite the edge connector.
Claims20
An apparatus, comprising:
- a printed circuit board (PCB) having an edge connector;
- at least one integrated circuit device disposed on a surface of the PCB;
- and
- a tubular heat spreader disposed along an edge of the PCB opposite the edge connector, wherein
- the tubular heat spreader is configured to permit a flow of forced air through the tubular heat spreader,
- the tubular heat spreader is attached to at least an edge of the PCB with solder connections that are thermally coupled to the plurality of memory devices, and
- an attached combination of the tubular heat spreader and the PCB has a height that is less than an installation height within a server rack by a clearance distance representative of limited room for exposing heat exchanging structures to the flow of forced air.
4 more elements
A circuit module, comprising:
- a printed circuit board (PCB) having an edge connector;
- a first plurality of integrated circuit devices disposed on a first surface of the PCB;
- a second plurality of integrated circuit devices disposed on a second surface of the PCB;
- and
- a tubular heat spreader disposed along an edge of the PCB opposite the edge connector, the tubular heat spreader having a thermal connection to the first and second pluralities of integrated circuit devices, wherein
- the tubular heat spreader is configured to permit a flow of forced air through the tubular heat spreader,
- the tubular heat spreader is attached to at least an edge of the PCB with solder connections that are thermally coupled to the first and/or second pluralities of integrated circuit devices, and
- an attached combination of the tubular heat spreader and the PCB has a height that is less than an installation height within a server rack by a clearance distance representative of limited room for exposing heat exchanging structures to the flow of forced air.
5 more elements
Dependencies are inferred from the claim text.