Semiconductor package with co-axial ball-grid-array

A method comprising:

• providing a printed circuit board;
• forming a first recess in the printed circuit board, wherein the first recess comprises a circular side surface and a bottom surface;
• forming a first solder ball in the first recess;
• and
• forming a first conductive wall positioned behind the circular side surface of the first recess, wherein the first conductive wall surrounds a side surface of the first solder ball;
• wherein the first conductive wall carries a ground reference voltage (Vss).

A computing device comprising:

• a printed circuit board;
• a first recess in the printed circuit board, the first recess comprising a circular side surface and a bottom surface;
• a first solder ball disposed in the first recess;
• and
• a first conductive wall positioned behind the circular side surface of the first recess, wherein the first conductive wall surrounds a side surface of the first solder ball;
• and
• a semiconductor package coupled to the first solder ball;
• wherein the first conductive wall carries a ground reference voltage (Vss).