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US 2022/0069914 A1Published application
Hybrid integration of microled interconnects with ics
AssigneeAvicenaTech, Corp.
InventorsRobert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
Life of this patent
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Abstract
For optical communications between semiconductor ICs, optical transceiver assembly subsystems may be integrated with a processor. The optical transceiver assembly subsystems may be monolithically integrated with processor ICs or they may be provided in separate optical transceiver ICs coupled to or attached to the processor ICs.
Claims11
A device including optical communication components, comprising:
- a processor IC;
- an optical transceiver subsystem with elements in or attached to an optical transceiver IC, the optical transceiver IC electrically coupled to the processor IC, the optical transceiver subsystem including a plurality of transmitter instances and receiver instances;
- with each of the transmitter instances including transmitter circuitry in the optical transceiver IC and a microLED, bonded to a top surface of the optical transceiver IC, electrically connected to the transmit circuitry;
- with each of the receiver instances including receiver circuitry in the optical transceiver IC and a photodetector, in or bonded to a top surface of the optical transceiver IC, electrically connected to the receiver circuitry;
- and
- the optical transceiver IC including vias coupling the transmitter circuitry and the receiver circuitry to pads on a bottom surface of the optical transceiver IC, the optical transceiver IC being coupled to the processor IC at least in part by the pads.
3 more elements
Dependencies are inferred from the claim text.