Package comprising an integrated passive device configured as a cap for a filter

An apparatus comprising:

• means for acoustic filtering;
• means for passive functionality coupled to the means for acoustic filtering, wherein the means for passive functionality is configured as a cap for the means for acoustic filtering;
• and
• a void located between the means for acoustic filtering and the means for passive functionality.

A method for fabricating a package, comprising:

• providing an integrated device configured as a filter, the integrated device comprising:
• a substrate comprising a piezoelectric material;
• and
• at least one metal layer coupled to a first surface of the substrate;
• and
• coupling an integrated passive device to the integrated device, wherein the integrated passive device is configured as a cap for the integrated device, wherein coupling the integrated passive device to the integrated device forms a void located between the integrated device and the integrated passive device.