Semiconductor light emitting device and method for manufacturing the same
AssigneeSl Vionics Co., Ltd.
InventorsKyoung Min KIM, Gye Oul JEONG, Eun Hyun PARK
Life of this patent
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Abstract
Disclosed is a semiconductor light emitting device comprising at least one semiconductor light emitting chip, with each chip including a plurality of electrodes; a plurality of pads arranged at a designated distance from the plurality of electrodes on a plane, respectively; electrical connections provided on the same plane as the plurality of pads for electrically connecting the electrodes and the pads, respectively; and an encapsulation member for covering the at least one semiconductor light emitting chip.
Claims19
A semiconductor light emitting device, comprising:
- at least one semiconductor light emitting chip, with each chip including a plurality of electrodes;
- a plurality of pads arranged at a designated distance from the plurality of electrodes on a plane, respectively;
- electrical connections provided on the same plane as the plurality of pads for electrically connecting the electrodes and the pads, respectively;
- and
- an encapsulation member for covering the at least one semiconductor light emitting chip.
A method for manufacturing a semiconductor light emitting device including at least one semiconductor light emitting chip, the method comprising:
- preparing a substrate;
- providing the at least one semiconductor light emitting chip on the substrate;
- providing an encapsulation member over the substrate and the semiconductor light emitting chips;
- removing the substrate;
- and
- forming, on the encapsulation member, electrical connections between pads and the semiconductor light emitting chips, respectively, with each of the pads being arranged at a designated distance from each of the light emitting chips.
A method for manufacturing a semiconductor light emitting device including at least one semiconductor light emitting chip, the method comprising:
- preparing a substrate;
- forming, on the substrate, electrical connections for connecting a plurality of pads and the at least one semiconductor light emitting chip, respectively, with the plurality of pads being arranged at a designated distance from the semiconductor light emitting chips;
- providing the at least one semiconductor light emitting chip on the substrate;
- providing an encapsulation member over the substrate and the semiconductor light emitting chips;
- and
- removing the substrate.
Dependencies are inferred from the claim text.