Method for manufacturing imaging module

A method for manufacturing an imaging module, the imaging module comprising a moved element, the moved element comprising:

• an imaging sensing element, an aperture, a lens or a reflector, and the method comprising:
• providing a first substrate and bonding a first dielectric layer on the first substrate;
• patterning the first dielectric layer to form at least one first bump and at least one second bump, wherein the at least one first bump and the at least one second bump are mutually independent, and a region surrounded by the at least one second bump defines a location region of the moved element;
• providing a piezoelectric element, adhering one end of the piezoelectric element to the first bump through a first adhesion material and making the other end of the piezoelectric element at least partially located above the second bump, wherein under the power-on state, the other end of the piezoelectric element is warped upwards or downwards so as to drive the moved element to move upwards or downwards;
• adhering the moved element to the second bump through a second adhesion material, wherein the moved element and the second bump have opposite parts, a groove is surrounded by the moved element, the second adhesion material and the second bump, or the moved element is provided with a film layer extending out of the moved element and a groove is surrounded by the film layer, the second adhesion material and the second bump;
• and
• debonding to remove the first substrate.