Semiconductor package

A semiconductor package comprising:

• a substrate;
• a semiconductor chip on a top surface of the substrate;
• and
• a passive element on a bottom surface of the substrate,
• wherein the substrate comprises:
• a first passive element pad and a second passive element pad that are exposed by the bottom surface of the substrate;
• a dam extending downwardly from the bottom surface of the substrate,
• wherein the dam is disposed between the first passive element pad and the second passive element pad when viewed in a plan view,
• wherein the passive element comprises:
• a first electrode portion electrically connected to the first passive element pad;
• and
• a second electrode portion electrically connected to the second passive element pad.

A semiconductor package comprising:

• a substrate having a first surface and a second surface, the first surface is spaced apart from the second surface in a first direction;
• a semiconductor chip on the first surface of the substrate;
• a molding layer disposed on the first surface and surrounding the semiconductor chip;
• an upper package part on the molding layer;
• and
• a passive element on the second surface of the substrate, wherein the substrate comprises:
• a first passive element pad exposed by the second surface;
• a second passive element pad exposed by the second surface and spaced apart from the first passive element pad in a second direction intersecting the first direction;
• and
• a dam extending from the second surface in a direction opposite to the first direction, wherein the dam comprises:
• a first dam disposed between the first passive element pad and the second passive element pad when viewed in a plan view;
• and
• a second dam disposed between the first passive element pad and the second passive element pad in a plan view and spaced apart from the first dam in a third direction intersecting the first direction and the second direction,
• wherein the passive element is disposed between the first dam and the second dam,
• wherein the passive element comprises:
• a first electrode portion electrically connected to the first passive element pad;
• and
• a second electrode portion electrically connected to the second passive element pad.